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Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
Simultaneous multithreading (SMT) is a technique for improving the overall efficiency of superscalar CPUs with hardware multithreading. SMT permits multiple independent threads of execution to better use the resources provided by modern processor architectures .
In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture.
With recent changes in the economic climate the requirement for SMT placement becomes focused on the machine's versatility to deal with short runs and fast changeover. [citation needed] This means that lower cost machines with vision systems provide an affordable option for SMT users. There are more users of low end and mid-range machines than ...
A stud grid array (SGA) is a short-pinned pin grid array chip scale package for use in surface-mount technology. The polymer stud grid array or plastic stud grid array was developed jointly by the Interuniversity Microelectronics Centre (IMEC) and Laboratory for Production Technology, Siemens AG. [4] [5]
In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB; solder paste, which was previously applied to the pads, holds the components in place temporarily; if surface-mount components are applied to both sides of the board, the bottom-side ...
A more recent design variation which allows for higher density connections is the dual row micro lead frame (DRMLF) package. This is an MLF package with two rows of lands for devices requiring up to 164 I/O. Typical applications include hard disk drives, USB controllers, and wireless LAN.
"Workshop on SMT Stencils" (PDF). Chennai, India: Surface Mount Technology Association (SMTA). Archived (PDF) from the original on 2018-06-17; Mersits, Christopher (2012) [2010]. Investigation of aperture filling and release for modern developments of the solder paste stencil printing process. Binghamton, New York, USA: State University of New ...