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The written USB 3.0 specification was released by Intel and its partners in August 2008. The first USB 3.0 controller chips were sampled by NEC in May 2009, [4] and the first products using the USB 3.0 specification arrived in January 2010. [5] USB 3.0 connectors are generally backward compatible, but include new wiring and full-duplex operation.
The USB 3.1 specification takes over the existing USB 3.0's SuperSpeed USB transfer rate, now referred to as USB 3.1 Gen 1, and introduces a faster transfer rate called SuperSpeed USB 10 Gbps, corresponding to operation mode USB 3.1 Gen 2, [62] putting it on par with a single first-generation Thunderbolt channel.
The DL-41xx series came out in 2013. It is a USB 3.0 to LVDS device, supporting DL3 compression and HDCP 2.0 encryption. [26] It is designed to be embedded into monitors to enable USB as a video input on displays. It is described as a low-power device, which enables it to be powered from the USB bus without the need for an external power supply.
However, the SuperSpeed USB part of the system still implements the one-lane Gen 1×1 operation mode. Therefore, two-lane operations, namely USB 3.2 Gen 1×2 (10 Gbit/s) and Gen 2×2 (20 Gbit/s), are only possible with Full-Featured USB-C. As of 2023, they are somewhat rarely implemented; Intel, however, started to include them in its 11th ...
Open Pluggable Specification (OPS) is a computing module plug-in format available for adding computing capability to flat panel displays.. The format was first announced by NEC, Intel, and Microsoft in 2010.
The Linux kernel has supported USB mass-storage devices since version 2.3.47 [3] (2001, backported to kernel 2.2.18 [4]).This support includes quirks and silicon/firmware bug workarounds as well as additional functionality for devices and controllers (vendor-enabled functions such as ATA command pass-through for ATA-USB bridges, used for S.M.A.R.T. or temperature monitoring, controlling the ...
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