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2. Solder alloys - Wikipedia

   en.wikipedia.org/wiki/Solder_alloys

   For low-temperature soldering of heat-sensitive parts, and for soldering in the vicinity of already soldered joints without their remelting. Sn 43 Pb 43 Bi 14: 144: 163 [11] Pb: No: Bi14. Good fatigue resistance combined with low melting point. Contains phases of tin and lead-bismuth. [13] Useful for step soldering. Sn 46 Pb 46 Bi 8: 120: 167 ...

3. Fusible alloy - Wikipedia

   en.wikipedia.org/wiki/Fusible_alloy

   Combination with lead-tin solder may dramatically lower melting point and lead to joint failure. [10] Low-temperature eutectic solder with high strength. [11] Particularly strong, very brittle. [12] Used extensively in through-hole technology assemblies in IBM mainframe computers where low soldering temperature

4. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.

5. Bismuth–indium - Wikipedia

   en.wikipedia.org/wiki/Bismuth–indium

   It has a melting point lower than the eutectic point of the tin–lead alloy. The most common application of the Bi-In alloy is as a low temperature solder , which can also contain, besides bismuth and indium, lead , cadmium , and tin .

6. List of brazing alloys - Wikipedia

   en.wikipedia.org/wiki/List_of_brazing_alloys

   Low vapor pressure, suitable for vacuum work. Good ductility. Also classified as a solder. Lowest melting point alloy with low vapor pressure. 80: 20: Au 88 Ge 12: Au 356 [54] – Au88, Indalloy 183, Premabraze 880, Georo. Eutectic. Low ductility. Used for die attachment of some chips. The high temperature may be detrimental to the chips and ...

7. Tin-silver-copper - Wikipedia

   en.wikipedia.org/wiki/Tin-silver-copper

   One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method. The melting point of SAC alloys is 217–220 °C, or about 34 °C higher than the melting point of the eutectic tin-lead (63/37) alloy.

8. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   The American Welding Society defines brazing as using filler metals with melting points over 450 °C (842 °F) — or, by the traditional definition in the United States, above 800 °F (427 °C). Aluminium soldering alloys generally have melting temperatures around 730 °F (388 °C). [12]

9. Cerrosafe - Wikipedia

   en.wikipedia.org/wiki/Cerrosafe

   Cerrosafe is a fusible alloy with a low melting point.It is a non-eutectic mixture consisting of 42.5% bismuth, 37.7% lead, 11.3% tin, and 8.5% cadmium that melts between 70 °C (158 °F) and 88 °C (190 °F).