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  2. Solder - Wikipedia

    en.wikipedia.org/wiki/Solder

    Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, [17] though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. [18]

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Similar mechanical properties with Sn 63 Pb 37, Sn 62 Pb 36 Ag 2 and Sn 60 Pb 40, suitable lead-free replacement. Contains eutectic Sn-In phase with melting point at 118 °C, avoid use above 100 °C. Sn 86.9 In 10 Ag 3.1: 204: 205 [48] Yes: Potential use in flip-chip assembly, no issues with tin-indium eutectic phase. In 97 Ag 3: 143 [49] Yes: Yes

  4. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Common solder formulations based on tin and lead are listed below. The fraction represent percentage of tin first, then lead, totaling 100%: 63/37: melts at 183 °C (361 °F) (eutectic: the only mixture that melts at a point, instead of over a range) 60/40: melts between 183–190 °C (361–374 °F)

  5. List of brazing alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_brazing_alloys

    BrazeTec 60/40. For brazing zinc-coated tubes. ... Also classified as a solder. Lowest melting point alloy with low vapor pressure. 80: 20: ... 37: 60: In 3: Au 20 Cu ...

  6. Talk:Soldering iron - Wikipedia

    en.wikipedia.org/wiki/Talk:Soldering_iron

    * 63/37: melts between 180-185°C * 60/40: melts between 183–190°C * 50/50: melts between 185–215°C * lead-free solder: melts around 250°C While in this article, the temperature ranges given are: Lead-based solder uses 250°C to 280°C or 300°C while lead-free soldering needs a higher temperature, about 350°C to 400°C.

  7. Eutectic system - Wikipedia

    en.wikipedia.org/wiki/Eutectic_system

    Eutectic alloys for soldering, both traditional alloys composed of lead (Pb) and tin (Sn), sometimes with additional silver (Ag) or gold (Au) — especially Sn 63 Pb 37 and Sn 62 Pb 36 Ag 2 alloy formula for electronics - and newer lead-free soldering alloys, in particular ones composed of tin, silver, and copper (Cu) such as Sn 96.5 Ag 3.5.

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  9. Wave soldering - Wikipedia

    en.wikipedia.org/wiki/Wave_soldering

    This latter combination is strong, has a low melting range, and melts and sets quickly (i.e., no 'plastic' range between the solid and molten states like the older 60% tin / 40% lead alloy). Higher tin compositions give the solder higher corrosion resistances, but raise the melting point. Another common composition is 11% tin, 37% lead, 42% ...

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