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DDR2 is a 240-pin module, DDR is a 184-pin module. Notebooks have 200-pin SO-DIMMs for DDR and DDR2; however, the notch on DDR2 modules is in a slightly different position than on DDR modules. Higher-speed DDR2 DIMMs can be mixed with lower-speed DDR2 DIMMs, although the memory controller will operate all DIMMs at same speed as the lowest-speed ...
Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
Two types of DIMMs: a 168-pin SDRAM module (top) and a 184-pin DDR SDRAM module (bottom). The SDRAM module has two notches (rectangular cuts or incisions) on the bottom edge, while the DDR1 SDRAM module has one. Also, each module has eight RAM chips, but the lower one has an unoccupied space for the ninth chip; this space is occupied in ECC DIMMs.
Memory controller with differential serial connections to DDR2 FB-DIMMs. The AMB is visible in the center of each DIMM. A Fully Buffered DIMM (FB-DIMM) is a type of memory module used in computer systems. It is designed to improve memory performance and capacity by allowing multiple memory modules to be each connected to the memory controller ...
Ars Technica wrote in 2009 that Turbo Memory "never took off", [15] and CNET similarly pronounced that it was "never widely adopted", [16] because "Turbo Memory (and Turbo Memory 2.0) wasn't cheap, and it definitely wasn't worth the cost." [17] In 2009 Intel had announced the successor to Turbo Memory for the 5-Series mobile chipsets, codename ...
Modern DIMMs can for example feature one rank (single rank), two ranks (dual rank), four ranks (quad rank), or eight ranks (octal rank). [citation needed] There is only a little difference between a dual rank UDIMM and two single-rank UDIMMs in the same memory channel, other than that the DRAMs reside on different PCBs.
Compression Attached Memory Module , a standard developed by Dell, which uses a land grid array instead of the more common edge connector. Stacked vis-à-vis non-stacked RAM modules. Stacked RAM modules contain two or more RAM chips stacked on top of each other. This allows large modules to be manufactured using cheaper low density wafers.
There is a common belief that number of module ranks equals number of sides. As above data shows, this is not true. One can also find 2-side/1-rank modules. One can even think of a 1-side/2-rank memory module having 16(18) chips on single side ×8 each, but it is unlikely such a module was ever produced.
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