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For what it's worth, the IPC (general industry and military standard) J-STD-001 Handbook says that ROM1 fluxes (Kester RA "44") do not need to be cleaned for class 1 electronics: consumer electronics that will not cause major loss of money or life if they fail.
Moisture sensitivity level (MSL) is a rating that shows a device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020. It relates to the packaging and handling precautions for some semiconductors.
According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.
IPC is a global trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
SISO-STD-001.1-2015: Real-time Platform Reference Federation Object Model (RPR FOM 2.0) SISO-STD-002-2006: Standard for: Link16 Simulations SISO-STD-003-2006; Base Object Model (BOM) Template Specification
TADIL-J refers to the system of standardized J-series messages which are known by NATO as Link 16.These are defined by U.S. military standard (MIL-STD) 6016. It is used by the U.S. Navy, U.S. Army, U.S. Marine Corps, U.S. Air Force, U.S. Coast Guard, the NSA, several NATO countries, and Japan as part of the Multi-Tactical Data Link Network, a Tactical Data Link.
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In both JS-001-2012 and MIL-STD-883H the charged human body is modeled by a 100 pF capacitor and a 1500 ohm discharging resistance. During testing, the capacitor is fully charged to several kilovolts (2 kV, 4 kV, 6 kV and 8 kV are typical standard levels) and then discharged through the resistor connected in series to the device under test.