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The diffusion bonding process is able to produce high quality joints where no discontinuity or porosity exists in the interface. [13] In other words, we are able to sand, manufacturing and heat the material. Diffusion bonding enables the manufacture of high precision components with complex shapes. Also, diffusion is flexible.
The most established materials for thermocompression bonding are copper (Cu), gold (Au) and aluminium (Al) [1] because of their high diffusion rates. [4] In addition, aluminium and copper are relatively soft metals with good ductility.
Diffusion bonding works because atoms from both materials diffuse into the other material, resulting in a bond that is formed between the two materials. The diffusion of atoms between the two materials is achieved by placing the materials in contact with each other at high pressure and temperature, while not exceeding the melting temperature of ...
Transient liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with a lower melting point in an interlayer diffuses into the lattice and grain boundaries of the substrates at the bonding temperature. Solid state diffusional processes lead to a change of ...
Superplastic forming and diffusion bonding (SPF/DB) is a technique allowing the manufacture of complex-shaped hollow metallic parts. It combines Superplastic forming (SPF) with a second element "Diffusion Bonding" to create the completed structures.
MMCs are fabricated at elevated temperatures, which is an essential condition for diffusion bonding of the fiber/matrix interface. Later on, when they are cooled down to the ambient temperature, residual stresses (RS) are generated in the composite due to the mismatch between the coefficients of the metal matrix and fiber.
The Kirkendall effect is the motion of the interface between two metals that occurs due to the difference in diffusion rates of the metal atoms. The effect can be observed, for example, by placing insoluble markers at the interface between a pure metal and an alloy containing that metal, and heating to a temperature where atomic diffusion is reasonable for the given timescale; the boundary ...
Direct bonding, or fusion bonding, is a wafer bonding process without any additional intermediate layers. It is based on chemical bonds between two surfaces of any material possible meeting numerous requirements. [1] These requirements are specified for the wafer surface as sufficiently clean, flat and smooth.