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  2. Heat sink - Wikipedia

    en.wikipedia.org/wiki/Heat_sink

    The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:

  3. Thermal management (electronics) - Wikipedia

    en.wikipedia.org/wiki/Thermal_management...

    Generally, forced convection heat sink thermal performance is improved by increasing the thermal conductivity of the heat sink materials, increasing the surface area (usually by adding extended surfaces, such as fins or foam metal) and by increasing the overall area heat transfer coefficient (usually by increase fluid velocity, such as adding ...

  4. Computer cooling - Wikipedia

    en.wikipedia.org/wiki/Computer_cooling

    Passive heatsink cooling involves attaching a block of machined or extruded metal to the part that needs cooling. A thermal adhesive may be used. More commonly for a personal computer CPU, a clamp holds the heatsink directly over the chip, with a thermal grease or thermal pad spread between. This block has fins and ridges to increase its ...

  5. Pentium III - Wikipedia

    en.wikipedia.org/wiki/Pentium_III

    The Katmai used the same slot-based design as the Pentium II but with the newer Slot 1 Single Edge Contact Cartridge (SECC) 2 that allowed direct CPU core contact with the heat sink. There have been some early models of the Pentium III with 450 and 500 MHz packaged in an older SECC cartridge intended for original equipment manufacturers (OEMs).

  6. Thermal design power - Wikipedia

    en.wikipedia.org/wiki/Thermal_design_power

    To better understand the problem we must remember the basic concepts underlying Thermal management and Computer cooling. [26] Let’s consider the thermal conduction path from the CPU case to the ambient air through a Heat sink, with: Pd = Thermal power generated by a CPU and to be dissipated into the ambient through a suitable Heat sink.

  7. Download, install, or uninstall AOL Desktop Gold - AOL Help

    help.aol.com/articles/aol-desktop-downloading...

    Learn how to download and install or uninstall the Desktop Gold software and if your computer meets the system requirements.

  8. AOL Mail

    mail.aol.com

    Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!

  9. Thermal interface material - Wikipedia

    en.wikipedia.org/wiki/Thermal_interface_material

    A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).

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