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The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...
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Passive cooling covers all natural processes and techniques of heat dissipation and modulation without the use of energy. [1] Some authors consider that minor and simple mechanical systems (e.g. pumps and economizers) can be integrated in passive cooling techniques, as long they are used to enhance the effectiveness of the natural cooling process. [7]
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