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2. Epoxy putty - Wikipedia

   en.wikipedia.org/wiki/Epoxy_putty

   Epoxy putty refers to a group of room-temperature-hardening substances used as space-filling adhesives. Exact compositions vary according to manufacturer and application. Exact compositions vary according to manufacturer and application.

3. Filler (materials) - Wikipedia

   en.wikipedia.org/wiki/Filler_(materials)

   Filler can have a negative or positive effect on fatigue resistance depending on the filler type and shape. In general fillers create small discontinuities in the matrix. This can contribute to crack initiation point. If the filler is brittle fatigue resistance will be low, whereas if the filler is very ductile the composite will be fatigue ...

4. Resorcinol glue - Wikipedia

   en.wikipedia.org/wiki/Resorcinol_glue

   Until the invention of epoxy resin, resorcinol was one of the most common marine glues. Unlike epoxy, it does not have gap filling properties, requiring joints to be close fitting and clamped under pressure to achieve good results. The glue comes in two parts, a deep red syrup and a light brown powder, that are mixed to form a dark reddish ...

5. Epoxy - Wikipedia

   en.wikipedia.org/wiki/Epoxy

   Epoxy is the family of basic components or cured end products of epoxy resins. Epoxy resins, also known as polyepoxides, are a class of reactive prepolymers and polymers which contain epoxide groups. The epoxide functional group is also collectively called epoxy. [1] The IUPAC name for an epoxide group is an oxirane.

6. Spackling paste - Wikipedia

   en.wikipedia.org/wiki/Spackling_paste

   Spackling paste or spackle is a putty used to fill holes, small cracks, and other minor surface defects in wood, drywall, and plaster. [ 1 ] [ 2 ] Typically, spackling is composed of gypsum plaster from hydrated calcium sulfate and glue .

7. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   A small transformer potted in epoxy. The surface visible on the right is formed by the potting compound that has been poured into the plastic box. In electronics, potting is the process of filling a complete electronic assembly with a solid or gelatinous compound.