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  2. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...

  3. Electron-beam physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Electron-beam_physical...

    The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm / min at relatively low substrate temperatures, with very high material utilization efficiency.

  4. Cathodic arc deposition - Wikipedia

    en.wikipedia.org/wiki/Cathodic_arc_deposition

    Cathodic arc deposition or Arc-PVD is a physical vapor deposition technique in which an electric arc is used to vaporize material from a cathode target. The vaporized material then condenses on a substrate, forming a thin film. The technique can be used to deposit metallic, ceramic, and composite films.

  5. images.huffingtonpost.com

    images.huffingtonpost.com/2012-08-30-3258_001.pdf

    Created Date: 8/30/2012 4:52:52 PM

  6. Sputter deposition - Wikipedia

    en.wikipedia.org/wiki/Sputter_deposition

    Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. [1] [2]

  7. Ion plating - Wikipedia

    en.wikipedia.org/wiki/Ion_plating

    Ion plating (IP) is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a modified version of vacuum deposition. Ion plating uses concurrent or periodic bombardment of the substrate, and deposits film by atomic-sized energetic particles called ions.

  8. Vacuum deposition - Wikipedia

    en.wikipedia.org/wiki/Vacuum_deposition

    When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).

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