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Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
Electroless nickel plating, covered by a thin layer of gold, is used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improving the solderability of copper contacts and plated through holes and vias. The gold is typically applied by quick immersion in a solution containing gold salts.
Electroless nickel plating uses nickel salts as the metal cation source and either hypophosphite (H 2 PO 2-) (or a borohydride-like compound) as a reducer. [5] A side reaction forms elemental phosphorus (or boron) which is incorporated in the coating. The classical deposition methods follows the following steps:
This process is limited to very thin coatings, since the reaction stops after the substrate has been completely covered. Nevertheless, it has some important applications, such as the electroless nickel immersion gold (ENIG) process used to obtain gold-plated electrical contacts on printed circuit boards.
Nickel electroforming has nickel plating applied for fabrication of nickel products. For example, nickel can be deposited onto a mandrel and then lifted off the latter, creating a nickel-only part. [8] Nickel is also used as an undercoat for chrome or gold plating, as it improves adhesion and the longevity of the final layer.
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