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  2. Electroless nickel immersion gold - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni 2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG .

  3. Electroless nickel-phosphorus plating - Wikipedia

    en.wikipedia.org/wiki/Electroless_nickel...

    The gold is typically applied by quick immersion in a solution containing gold salts. This process is known in the industry as electroless nickel immersion gold (ENIG). A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG. [19]

  4. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Electroless deposition is an important process in the electronic industry for metallization of substrates. Other metallization of substrates also include physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating which produce thin metal films but require high temperature, vacuum, and a power source respectively. [19]

  5. Gold plating - Wikipedia

    en.wikipedia.org/wiki/Gold_plating

    Layers of gold thinner than 0.5 μm (0.02 thou) also dissolve completely into the solder, exposing the underlying metal (usually nickel) to the solder. Impurities in the nickel layer can prevent the solder from bonding to it. Electroless nickel plating contains phosphorus. Nickel with more than 8% phosphorus is not solderable.

  6. Printed circuit board - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board

    Other platings used are organic solderability preservative (OSP), immersion silver (IAg), immersion tin (ISn), electroless nickel immersion gold (ENIG) coating, electroless nickel electroless palladium immersion gold (ENEPIG), and direct gold plating (over nickel).

  7. Metal assisted chemical etching - Wikipedia

    en.wikipedia.org/wiki/Metal_assisted_chemical...

    Since MACE is an anisotropic etching method (etching takes place not in all spatial directions) a pre-defined metal pattern can be directly transferred into the silicon substrate. Another method of depositing metal particles or thin films is electroless plating of noble metals on the surface of silicon. Since the redox potentials of the redox ...

  8. DeBrusk stars as the Canucks hold off the Senators for a 4-3 win

    www.aol.com/debrusk-stars-canucks-hold-off...

    Jake DeBrusk had two goals and an assist, and the Vancouver Canucks beat the Ottawa Senators 4-3 on Saturday night. Kiefer Sherwood had a goal and an assist for Vancouver in the opener of a six ...

  9. Metallizing - Wikipedia

    en.wikipedia.org/wiki/Metallizing

    The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf /cm or 10 to 60 N /cm or 5 to 35 lbf /in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.