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Socket 478 was launched in August 2001 in advance of the Northwood core to compete with AMD's 462-pin Socket A and their Athlon XP processors. Socket 478 was intended to be the replacement for Socket 423, a Willamette-based processor socket which was on the market for only a short time. This was the last Intel desktop socket to use a pin grid ...
Intel Core 2 Duo T9600 CPU showing Socket P. The front-side bus (FSB) of CPUs that install in Socket P can run at 400, 533, 667, 800, or 1066 MT/s.By adapting the multiplier the frequency of the CPU can throttle up or down to save power, given that all Socket P CPUs support EIST, except for Celeron that do not support EIST.
Socket 479 (mPGA479M) is a CPU socket used by some Intel microprocessors. It is the socket used by the Pentium M and Celeron M mobile processors normally used in laptops, [1] but has also been used with Tualatin-M Pentium III processors. The official naming by Intel is μFCPGA and μPGA479M.
In Intel's Tick-Tock cycle, the 2007/2008 "Tick" was the shrink of the Core microarchitecture to 45 nanometers as CPUID model 23. In Core 2 processors, it is used with the code names Penryn (Socket P), Wolfdale (LGA 775) and Yorkfield (MCM, LGA 775), some of which are also sold as Celeron, Pentium and Xeon processors.
AMD Processors for Desktops: AMD Phenom, AMD Athlon FX, AMD Athlon X2 Dual-Core, AMD Athlon, and AMD Sempron Processor; sandpile.org – AA-64 implementation – AMD K8; AMD 64 OPN reference guide – Fab51; Socket AM2 CPUs listed, specced, priced up – The Inquirer; Chip identification by model number
To keep costs low on high-volume competitive products, the CPU core is usually bundled into a system-on-chip (SOC) integrated circuit. SOCs contain the processor core, cache and the processor's local data on-chip, along with clocking, timers, memory (SDRAM), peripheral (network, serial I/O), and bus (PCI, PCI-X, ROM/Flash bus, I2C) controllers.
Tunnel Creek" CPU with an Altera Field Programmable Gate Array (FPGA) CPU core supports IA-32 architecture, MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Hyper-Threading, Intel VT-x; Package size: 37.5 mm × 37.5 mm; Steppings: B0; TDP without FPGA. Total package TDP depends on functions included in FPGA. Max. TDP 7 W.
AMD specify that the 9xxx series processors require "robust liquid cooling" due to their high Thermal Design Power (TDP) [20] Trinity & Richland Athlon series CPU – Desktop Budget market: Socket FM2 Athlon X4 730, 740, 750K and 760k CPU models feature the four Piledriver core Trinity microarchitecture but lack on-chip integrated graphics ...