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  2. Tin-silver-copper - Wikipedia

    en.wikipedia.org/wiki/Tin-silver-copper

    Typical alloys are 34% silver, 0.5–0.7% copper, and the balance (95%+) tin. [3] For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some applications, such as SAC105 and SAC0307 (0.3% silver, 0.7% copper), at the expense of a somewhat higher melting point.

  3. Solder alloys - Wikipedia

    en.wikipedia.org/wiki/Solder_alloys

    Copper content must be maintained between 0.4–0.85%, e.g. by refilling the bath with Sn 96.5 Ag 3.5 alloy (designated e.g. SN 96 Ce). Nitrogen atmosphere can be used to reduce losses by dross formation. Dull, surface shows formation of dendritic tin crystals. Sn 95.6 Ag 3.5 Cu 0.9: 217: Yes: Yes: Determined by NIST to be truly eutectic. Sn 95 ...

  4. Flux (metallurgy) - Wikipedia

    en.wikipedia.org/wiki/Flux_(metallurgy)

    Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

  5. List of brazing alloys - Wikipedia

    en.wikipedia.org/wiki/List_of_brazing_alloys

    For steels where lower temperature than with pure copper is required. 95: 4.7: 0.3: Cu 93.5 Sn 6. ... step soldering. The original flux-less alloy, does not need flux ...

  6. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Wave soldering uses surface tension to keep solder from bridging the insulating gaps between the copper lines of flux-coated printed wiring boards/printed circuit boards. The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in ...

  7. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    To produce a quality solder joint, it's very important for the spheres of metal to be very regular in size and have a low level of oxidation [citation needed]. Solder pastes are classified based on the particle size by IPC standard J-STD 005. [3] The table below shows the classification type of a paste compared with the mesh size and particle ...

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