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Besides a fan, it could possibly also be cooled by other means, such as a Peltier cooler (although Peltier elements are most commonly placed directly on top of the hardware to be cooled, and the coolant is used to conduct the heat away from the hot side of the Peltier element). [25] [26] A coolant reservoir is often also connected to the system ...
A heat sink usually consists of a base with one or more flat surfaces and an array of comb or fin-like protrusions to increase the heat sink's surface area contacting the air, and thus increasing the heat dissipation rate. While a heat sink is a static object, a fan often aids a heat sink by providing increased airflow over the heat sink—thus ...
Heat sinks are devices that are used to extend the surface area of electronic components available for air cooling, helping to lower the components case temperature. Fans are used to increase the air flow. Thermal design and analysis is performed using hand calculations or spreadsheets, based on design rules or heat transfer correlations.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current.
A heat sink (aluminum) with its heat pipes (copper) and fan (black) A heat sink (also commonly spelled heatsink, [1]) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of ...
These are solid-state devices and unlike dynamos have no moving parts, with the occasional exception of a fan or pump to improve heat transfer. If the hot region is around 1273K and the ZT values of 3 - 4 are implemented, the efficiency is approximately 33-37%; allowing TEG's to compete with certain heat engine efficiencies.
The addition of fins to a heat sink increases its total surface area, resulting in greater cooling effectiveness. There are two types of cooling pads that can be used for air cooling: one is the honeycomb design and another one is excelsior. [citation needed] In all cases, the air has to be cooler than the object or surface from which it is ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
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