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The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more.
Bare silicon chip, an early chip-scale package CSP: Chip-scale package: Package size is no more than 1.2× the size of the silicon chip [16] [17] TCSP: True chip-size package: Package is same size as silicon [18] TDSP: True die-size package: Same as TCSP [18] WCSP or WL-CSP or WLCSP: Wafer-level chip-scale package
Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3 3D model of TO-3 package. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.
A coloured drawing of the front of a TO-220 transistor package: Date: 26 March 2007: Source: Own drawing, done in Inkscape: ... Dimensions User Comment; current: 19: ...
Several variants of the original TO-5 package have the same cap dimensions but differ in the number and length of the leads (wires). Somewhat incorrectly, TO-5 and TO-39 are often used in manufacturer's literature as synonyms for any package with the cap dimensions of TO-5, regardless of the number of leads, or even for any package with the diameter of TO-5, regardless of the cap height and ...
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Size comparison of transistor packages. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations,. [1]
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