Search results
Results from the WOW.Com Content Network
The mainstream 65 nanometer Core 2 Quad Q6600, clocked at 2.4 GHz, was launched on January 8, 2007 at US$851 (reduced to US$530 on April 7, 2007). July 22, 2007 marked the release of the Core 2 Quad Q6700 and Core 2 Extreme QX6850 Kentsfields at US$530 and US$999 respectively; the price of the Q6600 was later reduced to US$266. [2]
A good temperature for your desktop computer's CPU is around 120℉ when idle, and under 175℉ when under stress.
A finned air cooled heatsink with fan clipped onto a CPU, with a smaller passive heatsink without fan in the background A 3-fan heatsink mounted on a video card to maximize cooling efficiency of the GPU and surrounding components Commodore 128DCR computer's switch-mode power supply, with a user-installed 60 mm cooling fan.
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
It can change computer fan speeds depending on the temperature of various components. [ 1 ] [ 4 ] The program can display system variables as charts and as an indicator in the system tray . [ 1 ] [ 4 ] [ 5 ] Fully configurable user events can be defined to execute specific actions based on system status [ 6 ]
Get AOL Mail for FREE! Manage your email like never before with travel, photo & document views. Personalize your inbox with themes & tabs. You've Got Mail!
typical thermal power, which is measured under normal load (for instance, AMD's average CPU power) maximum thermal power, which is measured under a worst-case load; For example, the Pentium 4 2.8 GHz has a 68.4 W typical thermal power and 85 W maximum thermal power. When the CPU is idle, it will draw far less than the typical thermal power.
The spreading resistance phenomenon is shown by how the heat travels from the heat source location and causes a large temperature gradient between the heat source and the edges of the heat sink. This means that some fins are at a lower temperature than if the heat source were uniform across the base of the heat sink.