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Support for up to 16 DIMMs of DDR4 memory per CPU socket, maximum 4 TB.; Supports up to two sockets [1]; PCI Express 4.0 lanes: 64-M: Media processing specialized-N: Network & NFV specialized
16 Ice Lake-based. Toggle Ice Lake-based subsection ... List of Intel Xeon processors. 5 languages. Español; ... Xeon Gold 5411N; Xeon Gold 5412U; Xeon Gold 5415 ...
Ice Lake was designed by Intel Israel's processor design team in Haifa, Israel. [17] [18]Ice Lake is built on the Sunny Cove microarchitecture. [19] [20] Intel released details of Ice Lake during Intel Architecture Day in December 2018, stating that the Sunny Cove core Ice Lake would be focusing on single-thread performance, new instructions, and scalability improvements.
Xeon Platinum supports up to eight sockets; Xeon Gold supports up to four sockets; Xeon Silver and Bronze support up to two sockets; No suffix letter: up to 1.0TB DDR4 per socket-L: Large DDR memory tier support (up to 4.5TB)-M: Medium DDR memory tier support (up to 2.0TB)-N: Network & NFV specialized-R: Refresh (higher performance)
Released as the Dual-Core Xeon 5000-series, Dempsey is a NetBurst microarchitecture processor produced using a 65 nm process, and is virtually identical to Intel's "Presler" Pentium Extreme Edition, except for the addition of SMP support, which lets Dempsey operate in dual-processor systems. Dempsey ranges between 2.50 GHz and 3.73 GHz (model ...
Cooper Lake is Intel's codename for the third-generation of their Xeon Scalable processors, developed as the successor to Cascade Lake-SP. Cooper Lake processors are targeted at the 4S and 8S segments of the server market; Ice Lake-SP serves the 1S and 2S segment. [1] [2] [3]
Elkhart Lake: embedded processors targeted at IoT, released in Q1 2021. Gracemont Intel 7 process [19] Atom microarchitecture iteration after Tremont. First Atom class core with AVX and AVX2 support. Alder Lake: hybrid processor, succeeds Rocket Lake and Tiger Lake, released on November 4, 2021. Gracemont is used in E-cores of Alder Lake ...
Intel Xeon 3060 die shot. Based on Core microarchitecture; All models support: MMX, SSE, SSE2, SSE3, SSSE3, Intel 64, XD bit (an NX bit implementation), Intel VT-x; All models support uni-processor configurations; Die size: 143 mm 2; Steppings: B2, G0
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