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Diagram of a laser cutter Laser cutting process on a sheet of steel CAD (top) and stainless steel laser-cut part (bottom) Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and ...
Lasers are used in optical disc drives, laser printers, barcode scanners, DNA sequencing instruments, fiber-optic and free-space optical communications, semiconductor chip manufacturing (photolithography, etching), laser surgery and skin treatments, cutting and welding materials, military and law enforcement devices for marking targets and ...
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. [1] It can involve scribing and breaking, mechanical sawing (normally with a machine called a dicing saw) [2] or laser cutting.
Judy also had a facelift, upper blepharoplasty and a fractionated CO2 laser skin on the day of her neck lift. While it sounds like a lot, she said the recovery was way easier than expected.
With cut-and-capture, a cap coated with an adhesive is positioned directly on the thinly cut (5-8 μm) tissue section, the section itself resting on a thin membrane (polyethylene naphthalene). An IR laser gently heats the adhesive on the cap fusing it to the underlying tissue and an UV laser cuts through tissue and underlying membrane.
where t is the depth of cut, P is the laser beam power, v is the cutting velocity, and d is the laser beam spot diameter. [5] The depth of the cut is also influenced by the workpiece material. The material's reflectivity, density, specific heat, and melting point temperature all contribute to the lasers ability to cut the workpiece.
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