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A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. [1] A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
Thermal adhesive is a type of thermally conductive glue used for electronic components and heat sinks. It can be available as a paste (similar to thermal paste) or as a double-sided tape. [1] It is commonly used to bond integrated circuits to heatsinks where there are no other mounting mechanisms available.
In computing and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin wax or silicone based) commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled (such as a CPU or another chip) and into the heatsink (usually made from aluminium or copper).
It has served as a substitute mainly for hemp, cotton and silk, in products such as parachutes, cords, sails, flak vests and clothing. Nylon fibres are useful in making fabrics, rope, carpets and musical strings, whereas, in bulk form, nylon is used for mechanical parts including machine screws, gears and power tool casings.
Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a fastener such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste.
Panel stiffness is also dependent on the design of the panel. For instance, the fibre reinforcement and matrix used, the method of panel build, thermoset versus thermoplastic, and type of weave. In contrast to composites, isotropic materials (for example, aluminium or steel), in standard wrought forms, possess the same stiffness typically ...
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