Search results
Results from the WOW.Com Content Network
An RF admittance level sensor uses a rod probe and RF source to measure the change in admittance. The probe is driven through a shielded coaxial cable to eliminate the effects of changing cable capacitance to ground. When the level changes around the probe, a corresponding change in the dielectric is observed.
Wafer testing is a step performed during semiconductor device fabrication after back end of line (BEOL) and before IC packaging.. Two types of testing are typically done. Very basic wafer parametric tests (WPT) are performed at a few locations on each wafer to ensure the wafer fabrication process has been carried out successfully.
Ideally a gate-level circuit would be completely tested by applying all possible inputs and checking that they gave the right outputs, but this is completely impractical: an adder to add two 32-bit numbers would require 2 64 = 1.8*10 19 tests, taking 58 years at 0.1 ns/test.
the probe will act as a circuit and affect the results of the test. For this reason, the tests performed at wafer sort cannot always be identical and as extensive as those performed at the final device test after packaging is complete [3] since the probe pads are typically on the perimeter of the IC, the IC can soon become pad-limited.
A common form of in-circuit testing uses a bed-of-nails tester.This is a fixture that uses an array of spring-loaded pins known as "pogo pins". When a printed circuit board is aligned with and pressed down onto the bed-of-nails tester, the pins make electrical contact with locations on the circuit board, allowing them to be used as test points for in-circuit testing.
Typical passive oscilloscope probe being used to test an integrated circuit. A test probe is a physical device used to connect electronic test equipment to a device under test (DUT). Test probes range from very simple, robust devices to complex probes that are sophisticated, expensive, and fragile.
Eddy Current Testing at Level 2, International Atomic Energy Agency, Vienna, 2011 (pdf 5.6 MB). ASTM E3052 Standard Practice for Examination of Carbon Steel Welds Using Eddy Current Array Official web page of Lorentz Force Velocimetry and Lorentz Force Eddy Current Testing Group Archived 2013-11-17 at the Wayback Machine
An intermittent fault, often called simply an "intermittent" [citation needed] (or anecdotally "interfailing" [citation needed]), is a malfunction of a device or system that occurs at intervals, usually irregular, in a device or system that functions normally at other times.