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About 100 times slower erosion of copper than ordinary tin/lead alloys. Suitable for soldering thin copper platings and very thin copper wires. [56] Sn 60 Pb 39 Cu 1: Pb: No: Sn 60 Pb 38 Cu 2: 183: 190 [16] [17] Pb: Cu2. Copper content increases hardness of the alloy and inhibits dissolution of soldering iron tips and part leads in molten ...
While pipe sizes in Australia are inch-based, they are classified by outside rather than inside diameter (e.g., a nominal 3 ⁄ 4 inch copper pipe in Australia has measured diameters of 0.750 inches outside and 0.638 inches inside, whereas a nominal 3 ⁄ 4 inch copper pipe in the U.S. and Canada has measured diameters of 0.875 inch outside and ...
Tin-silver-copper (Sn-Ag-Cu, also known as SAC), is a lead-free alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry, [ 1 ] as it is near eutectic , with adequate thermal fatigue properties, strength, and wettability. [ 2 ]
Used where ductility is important and low tolerances are not achievable. Ductile copper-copper joints. Used on electrical assemblies, e.g. motors or contacts. Used in refrigeration and air conditioning systems, and brass and copper pipe fitting. More fluid than BCuP-3 due to higher phosphorus content. Mutually soluble with copper and copper alloys.
Example of a copper alloy object: a Neo-Sumerian foundation figure of Gudea, circa 2100 BC, made in the lost-wax cast method, overall: 17.5 x 4.5 x 7.3 cm, probably from modern-day Iraq, now in the Cleveland Museum of Art (Cleveland, Ohio, USA) Copper alloys are metal alloys that have copper as their principal component.
Soldering performed using alloys with a melting point above 450 °C (840 °F; 720 K) is called "hard soldering", "silver soldering", or brazing. In specific proportions, some alloys are eutectic — that is, the alloy's melting point is the lowest possible for a mixture of those components, and coincides with the freezing point.
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Solderability when using lead-free alloys can differ significantly from solderability when using lead based alloys. Noble metals may be easy to solder but they have brittle joints. The metals in the good category require a large amount of heat therefore oxidation is an issue. To overcome this a flux is required.
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