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Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipsets , graphics cards ...
These sensors, after being calibrated at the factory, are able to provide digital data concerning processor temperature information. The PECI bus , allowing access to this data from chipset components, is a proprietary single-wire interface with a variable data transfer speed (from 2 kbit/s to 2 Mbit/s).
This heatsink is designed with the cooling capacity matching the CPU’s TDP. Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation.
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The front of the unit (facing the front of the PC case) has a 120 mm Radiator which is the primary heat exchanger.It is cooled by a fan. After passing the radiator, the cooling liquid moves through a thermoelectric fluid chiller consisting of a liquid cooling block with two Peltier plates.
CPU-Z is more comprehensive in virtually all areas compared to the tools provided in the Windows to identify various hardware components, and thus assists in identifying certain components without the need of opening the case; particularly the core revision and RAM clock rate. It also provides information on the system's GPU.
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The temperatures used in immersion cooling are determined by the highest temperature at which the devices being immersed can reliably operate. For servers this temperature range is typically between 15 and 65 °C (59 and 149 °F); [6] however, in ASIC-based crypto mining devices, this range is often extended up to 75 °C. [7]