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The Dell OptiPlex XE is a special version designed for equipment manufacturer, retail/point-of-sale (POS) systems. [37] They are based on the standard OptiPlex models with added features; such as a higher heat threshold, MIL-STD 810G testing [ 38 ] and powered USB/Serial.
The Intel Upgrade Service was a relatively short-lived and controversial program of Intel that allowed some low-end processors to have additional features unlocked by paying a fee and obtaining an activation code that was then entered in a software program, which ran on Windows 7.
One of the strengths of the PC-compatible design is its modular hardware design. End-users could readily upgrade peripherals and, to some degree, processor and memory without modifying the computer's motherboard or replacing the whole computer, as was the case with many of the microcomputers of the time. However, as processor speed and memory ...
To keep costs low on high-volume competitive products, the CPU core is usually bundled into a system-on-chip (SOC) integrated circuit. SOCs contain the processor core, cache and the processor's local data on-chip, along with clocking, timers, memory (SDRAM), peripheral (network, serial I/O), and bus (PCI, PCI-X, ROM/Flash bus, I2C) controllers.
Pentium M 755: 2 GHz 2 MB 400 MT/s 20× 0.988–1.34 V 21 W Socket 479; May 10, 2004 $637 Pentium M 760: 2 GHz 2 MB 533 MT/s 15× 1.26–1.356 V 27 W
Some motherboards using the 945 chipset could be given a BIOS upgrade to support 65nm Core-based processors. Other chipsets have varying levels of CPU support, generally following the release of contemporary CPUs, as LGA 775 CPU support is a complicated mixture of chipset capability, voltage regulator limitations and BIOS support.
Previously, the WDK was known as the Driver Development Kit (DDK) [4] and supported Windows Driver Model (WDM) development. It got its current name when Microsoft released Windows Vista and added the following previously separated tools to the kit: Installable File System Kit (IFS Kit), Driver Test Manager (DTM), though DTM was later renamed and removed from WDK again.
The CPU itself can withstand 200,000 to 1,000,000 Rads and temperature ranges between −55 and 125 °C. The RAD750 packaging and logic functions has a price tag in excess of US$ 200,000 [ citation needed ] : the high price is mainly due to radiation hardening revisions to the PowerPC 750 architecture and manufacturing, stringent quality ...