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2. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

3. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   A third method of soldering is to use a solder pot where the part (with flux) is dipped in a small heated iron cup of liquid solder, or a pump in a bath of liquid solder produces an elevated "wave" of solder which the part is quickly passed through.

4. Rosin - Wikipedia

   en.wikipedia.org/wiki/Rosin

   In industry, rosin is a flux used in soldering. The lead-tin solder commonly used in electronics has 1 to 2% rosin by weight as a flux core, helping the molten metal flow and making a better connection by reducing the refractory solid oxide layer formed at the surface back to metal. It is frequently seen as a burnt or clear residue around new ...

5. Solder - Wikipedia

   en.wikipedia.org/wiki/Solder

   In contrast to using traditional bars or coiled wires of all-metal solder and manually applying flux to the parts being joined, much hand soldering since the mid-20th century has used flux-core solder. This is manufactured as a coiled wire of solder, with one or more continuous bodies of inorganic acid or rosin flux embedded lengthwise inside it.

6. Reflow soldering - Wikipedia

   en.wikipedia.org/wiki/Reflow_soldering

   Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

7. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   The paste manufacturer will suggest a suitable reflow temperature profile to suit their individual paste. The main requirement is a gentle rise in temperature to prevent explosive expansion (which can cause "solder balling"), yet activate the flux. Thereafter, the solder melts. The time in this area is known as Time Above Liquidus. A reasonably ...