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The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
The following other wikis use this file: Usage on de.wikipedia.org Surface-mounted device; Usage on et.wikipedia.org Pinnaühendusega Tehnoloogia
Surface-mount technology (SMT), originally called planar mounting, [1] is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). [2] An electrical component mounted in this manner is referred to as a surface-mount device ( SMD ).
M7 general purpose diode in DO-214AC (SMA) package (surface mount version of 1N4007) [1] DO-214 is a standard that specifies a group of semiconductor packages for surface-mounted diodes . Overview
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device package with metal end terminals. Diodes and resistors are the most common MELF devices. [1] The EN 140401-803 and JEDEC DO-213 standards describe multiple MELF components. [2]
A thin-shrink small-outline package (TSSOP) is a rectangular, thin-body component. A TSSOP's leg count can range from 8 to 64. A TSSOP's leg count can range from 8 to 64. TSSOPs are particularly suited for gate drivers, controllers, wireless / RF , op-amps , logic , analog , ASICs , memory ( EPROM , E2PROM ), comparators and optoelectronics .
A tube and pipe may be specified by standard pipe size designations, e.g., nominal pipe size, or by nominal outside or inside diameter and/or wall thickness. The actual dimensions of pipe are usually not the nominal dimensions: A 1-inch pipe will not actually measure 1 inch in either outside or inside diameter, whereas many types of tubing are ...
Size comparison of BJT transistor packages, from left to right: SOT-23, TO-92, TO-126, TO-3 3D model of TO-3 package. In electronics, TO-3 is a designation for a standardized metal semiconductor package used for power semiconductors, including transistors, silicon controlled rectifiers, and, integrated circuits.
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