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Compression Attached Memory Module (CAMM) is a memory module form factor which uses a land grid array, and developed at Dell by engineer Tom Schnell as a replacement for DIMMs and SO-DIMMs which use edge connectors and had been in use for about 25 years. [1] The first SO-DIMMs were introduced by JEDEC in 1997. [2] [3] [4] [5]
An outline drawing of a Type I TSOP with 32 leads. Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume.
Bank switching allows blocks of RAM memory to be switched into the processor's address space when required, under program control. Operating systems routinely manage running programs using virtual memory, where individual program operate as if they have access to a large memory space that is being simulated by swapping memory areas with disk ...
Moreover, if a mainboard has a dual-or quad-channel memory subsystem, all of the memory channels must be upgraded simultaneously. 16-bit modules provide one channel of memory, while 32-bit modules provide two channels. Therefore, a dual-channel mainboard accepting 16-bit modules must have RIMMs added or removed in pairs.
Memory modules of SK Hynix. In computing, a memory module or RAM stick is a printed circuit board on which memory integrated circuits are mounted. [1] Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were ...
Pure memory stacking: two or more memory only packages are stacked on each other; Mixed logic-memory stacking: logic (CPU) package on the bottom, memory package on top. For example, the bottom could be a system on a chip (SoC) for a mobile phone. The logic package is on the bottom because it needs many more BGA connections to the motherboard.
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The documentation of modern memory modules, such as the standards for the memory ICs [8] and a reference design of the module [9] requires over one hundred pages. The standards specify the physical and electrical characteristics of the modules, and include the data for computer simulations of the memory module operating in a system. [10]