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From a control standpoint, the main difference between PECI and the previously used thermal monitoring methods is that PECI reports a negative value expressing the difference between the current temperature and the thermal throttle point (at which the CPU reduces speed or shuts down to prevent damage due to overheating) instead of the absolute ...
An AI accelerator, deep learning processor or neural processing unit (NPU) is a class of specialized hardware accelerator [1] or computer system [2] [3] designed to accelerate artificial intelligence (AI) and machine learning applications, including artificial neural networks and computer vision.
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
Block diagram of the Platform Controller Hub–based chipset architecture, including an Integrated Memory Controller (IMC) in the CPU An Intel DH82H81 PCH with its die exposed The Platform Controller Hub ( PCH ) is a family of Intel 's single-chip chipsets , first introduced in 2009.
CPU-Z is more comprehensive in virtually all areas compared to the tools provided in the Windows to identify various hardware components, and thus assists in identifying certain components without the need of opening the case; particularly the core revision and RAM clock rate. It also provides information on the system's GPU.
A memory protection unit (MPU) is a computer hardware unit that provides memory protection. It is usually implemented as part of the central processing unit (CPU). [ 1 ] MPU is a trimmed down version of memory management unit (MMU) providing only memory protection support.
Stress testing, in general, should put computer hardware under exaggerated levels of stress in order to ensure stability when used in a normal environment. These can include extremes of workload, type of task, memory use, thermal load (heat), clock speed, or voltages. Memory and CPU are two components that are commonly stress tested in this way.
More recently, in order to manage CPU power dissipation, processor makers favor multi-core chip designs, thus software needs to be written in a multi-threaded or multi-process manner to take full advantage of such hardware. Many multi-threaded development paradigms introduce overhead, and will not see a linear increase in speed when compared to ...