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A heat sink design must fulfill both its thermal as well as its mechanical requirements. Concerning the latter, the component must remain in thermal contact with its heat sink with reasonable shock and vibration. The heat sink could be the copper foil of a circuit board, or a separate heat sink mounted onto the component or circuit board.
The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
Typical LED package including thermal management design Thermal animation of a high powered A19 sized LED light bulb, created using high resolution computational fluid dynamics (CFD) analysis software, showing temperature contoured LED heat sink and flow trajectories Thermal animation of a high power density industrial PAR 64 LED downlight heat sink design, created using high resolution CFD ...
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
In a cross-flow, in which one system, usually the heat sink, has the same nominal temperature at all points on the heat transfer surface, a similar relation between exchanged heat and LMTD holds, but with a correction factor. A correction factor is also required for other more complex geometries, such as a shell and tube exchanger with baffles.
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat ...
A South Dakota man is facing murder and manslaughter charges after police say he killed a woman and decapitated her. According to court documents obtained by PEOPLE, Craig Allen Nichols Jr., 32 ...
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...
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