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The most common design of a heat sink is a metal device with many fins. The high thermal conductivity of the metal combined with its large surface area result in the rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink and whatever it is in direct thermal contact with.
The heat sink thermal resistance model consists of two resistances, namely the resistance in the heat sink base, , and the resistance in the fins, . The heat sink base thermal resistance, , can be written as follows if the source is a uniformly applied the heat sink base. If it is not, then the base resistance is primarily spreading resistance:
In a cross-flow, in which one system, usually the heat sink, has the same nominal temperature at all points on the heat transfer surface, a similar relation between exchanged heat and LMTD holds, but with a correction factor. A correction factor is also required for other more complex geometries, such as a shell and tube exchanger with baffles.
Thermodynamic heat pump cycles or refrigeration cycles are the conceptual and mathematical models for heat pump, air conditioning and refrigeration systems. [1] A heat pump is a mechanical system that transmits heat from one location (the "source") at a certain temperature to another location (the "sink" or "heat sink") at a higher temperature. [2]
Heat pipes may also be added to aluminum or copper heat sinks to reduce spreading resistance. Shape – Thermal transfer takes place at the surface of the heat sink. Therefore, heat sinks should be designed to have a large surface area. This goal can be reached by using a large number of fine fins or by increasing the size of the heat sink itself.
Open cavities are defined as the regions formed between adjacent fins and stand for the essential promoters of nucleate boiling or condensation. These cavities are usually utilized to extract heat from a variety of heat generating bodies. From 2004 until now, many researchers have been motivated to search for the optimal design of cavities. [2]
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation. Some sources state that the peak power rating for a microprocessor is usually 1.5 times the TDP ...
2 Basic heat sink heat transfer theory model. 3 Methods to determine heat sink thermal performance. 3.1 Heat transfer theoretical model 3.2 Experimental data 3.3 Numerical data 4 Design factors which influence the thermal performance of a heat sink. 4.1 Material 4.1.1 Fin efficiency 4.1.2 Spreading resistance 4.2 Fin arrangements 4.2.1 Pin fin
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