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To create a desirable surface for the adhesive bonding of plastics, there are three major requirements: the weak boundary layer of the given material must be removed or chemically modified to create a strong boundary layer; the surface energy of the adherend should be higher than that of the adhesive for good wetting; and the surface profile can be improved to provide mechanical interlocking.
The codes given in the chart below usually tell the length and width of the components in tenths of millimeters or hundredths of inches. For example, a metric 2520 component is 2.5 mm by 2.0 mm which corresponds roughly to 0.10 inches by 0.08 inches (hence, imperial size is 1008).
Surface activated bonding (SAB) is a non-high-temperature wafer bonding technology with atomically clean and activated surfaces. Surface activation prior to bonding by using fast atom bombardment is typically employed to clean the surfaces. High-strength bonding of semiconductor, metal, and dielectric can be obtained even at room temperature ...
The roughness of the surface should be less than 10 nm and free of contamination on the surface for the procedure to work properly. [8] Even though anodic bonding is relatively tolerant to contaminations, a widely established cleaning procedure RCA takes place to remove any surface impurities.
A surface to be joined is dipped into a vat of solvent, with the solvent depth being a controlled variable, for a set amount of time. Once the part has been removed from the vat, a screen mesh or foam pad is used to remove the excess solvent before the bonding surfaces are paired.
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Drawing of a tape-automated bonding carrier and definitions of various parts of the TAB assembly. Tape-automated bonding (TAB) is a process that places bare semiconductor chips (dies) like integrated circuits onto a flexible circuit board (FPC) by attaching them to fine conductors in a polyamide or polyimide (like trade names Kapton or UPILEX) film carrier.
In microelectronics, these properties can cause problems in wire bonding. The main compounds formed are usually Au 5 Al 2 (white plague) and AuAl 2 (purple plague), both of which form at high temperatures, then Au 5 Al 2 and AuAl 2 can further react with Au to form more stable compound, Au 2 Al.