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Structural integrity may be compromised, e.g., by misalignment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. [ 2 ] [ 3 ] [ 5 ] An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper.
Parts books were often issued as microfiche, though this has fallen out of favour. Now, many manufacturers offer this information digitally in an electronic parts catalogue. This can be locally installed software, or a centrally hosted web application. Usually, an electronic parts catalogue enables the user to virtually disassemble the product ...
A reference designator unambiguously identifies the location of a component within an electrical schematic or on a printed circuit board.The reference designator usually consists of one or two letters followed by a number, e.g. C3, D1, R4, U15.
In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement , which determines the location of each active element of an IC or component on a PCB.
A circuit diagram (or: wiring diagram, electrical diagram, elementary diagram, electronic schematic) is a graphical representation of an electrical circuit. A pictorial circuit diagram uses simple images of components, while a schematic diagram shows the components and interconnections of the circuit using standardized symbolic representations.
Wire crossover symbols for circuit diagrams. The CAD symbol for insulated crossing wires is the same as the older, non-CAD symbol for non-insulated crossing wires. To avoid confusion, the wire "jump" (semi-circle) symbol for insulated wires in non-CAD schematics is recommended (as opposed to using the CAD-style symbol for no connection), so as to avoid confusion with the original, older style ...
Decapping (decapsulation) or delidding of an integrated circuit (IC) is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die.
Some failures show only at extreme joint temperatures, hindering troubleshooting. Thermal expansion mismatch between the printed circuit board material and its packaging strains the part-to-board bonds; while leaded parts can absorb the strain by bending, leadless parts rely on the solder to absorb stresses.