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Chipsets supporting LGA 1156 CPUs (Lynnfield and Clarkdale). Not listed below is the 3450 chipset (see Xeon chipsets) which is compatible with Nehalem mainstream and high-end processors but does not claim core iX-compatibility. With either a Core i5 or i3 processor, the 3400-series chipsets enable the ECC functionality of unbuffered ECC memory ...
LGA 1150, [1] also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.
CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands ...
Intel Haswell Core i7-4771 CPU, sitting atop its original packaging that contains an OEM fan-cooled heatsink. This generational list of Intel processors attempts to present all of Intel's processors from the 4-bit 4004 (1971) to the present high-end offerings. Concise technical data is given for each product.
LGA 1156 LGA 1155 LGA 1150 LGA 1151 LGA 1200 LGA 1700: Intel 7, 14 nm, 22 nm, 32 nm, 45 nm, 65 nm 2.9 W – 73 W 1 or 2, 2 /w hyperthreading 800 MHz, 1066 MHz, 2.5GT/s, 5 GT/s 64 KiB per core 2x256 KiB – 2 MiB 0 KiB – 3 MiB Intel Core: Txxxx Lxxxx Uxxxx Yonah: 2006–2008 1.06 GHz – 2.33 GHz Socket M: 65 nm 5.5 W – 49 W 1 or 2
Desktop version (LGA 1150 socket and the LGA 2011-v3 socket): Haswell-DT; Mobile/Laptop version (PGA socket): Haswell-MB; BGA version: 47 W and 57 W TDP classes: Haswell-H (for "All-in-one" systems, Mini-ITX form factor motherboards, and other small footprint formats) 13.5 W and 15 W TDP classes : Haswell-ULT (for Intel's UltraBook platform)
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