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A stress test (sometimes called a torture test) of hardware is a form of deliberately intense and thorough testing used to determine the stability of a given system or entity. It involves testing beyond normal operational capacity , often to a breaking point, in order to observe the results.
Experimental tests are one of the more popular ways to determine the heat sink thermal performance. In order to determine the heat sink thermal resistance, the flow rate, input power, inlet air temperature and heat sink base temperature need to be known. Vendor-supplied data is commonly provided for ducted test results. [29]
Thermal expansion produces mechanical stresses that may cause material fatigue, especially when the thermal expansion coefficients of the materials are different. Humidity and aggressive chemicals can cause corrosion of the packaging materials and leads, potentially breaking them and damaging the inside parts, leading to electrical failure.
The dust buildup on this laptop CPU heatsink after three years of use has made the laptop unusable due to frequent thermal shutdowns. In operation, the temperature of a computer's components will rise until the heat transferred to the surroundings is equal to the heat produced by the component, that is, when thermal equilibrium is reached. For ...
Thermal Design Power (TDP), also known as thermal design point, is the maximum amount of heat that a computer component (like a CPU, GPU or system on a chip) can generate and that its cooling system is designed to dissipate during normal operation at a non-turbo clock rate (base frequency).
Thermal simulations give engineers a visual representation of the temperature and airflow inside the equipment. Thermal simulations enable engineers to design the cooling system; to optimise a design to reduce power consumption, weight and cost; and to verify the thermal design to ensure there are no issues when the equipment is built.
Thermal aging tests assess the effects of prolonged exposure to elevated temperatures on a material's chemical and physical properties. High temperatures can accelerate oxidation, polymer degradation, and phase transitions, leading to reduced mechanical strength and altered performance characteristics.
In computing, stress testing (sometimes called torture testing) can be applied to either hardware or software. It is used to determine the maximum capability of a computer system and is often used for purposes such as scaling for production use and ensuring reliability and stability. [2]