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Summit was a candy bar manufactured in the early 1980s by Mars in the United States. Labeled "cookie bars" on the packaging, [1] but "candy bars" in some advertising, [2] they consisted of two wafers covered with peanuts, all coated in chocolate. In 1983, Mars changed to individual foil wrapping and promoted the bar as having 30% more chocolate ...
Once tested, a wafer is typically reduced in thickness in a process also known as "backlap", [118]: 6 "backfinish", "wafer backgrind" or "wafer thinning" [191] before the wafer is scored and then broken into individual dies, a process known as wafer dicing. Only the good, unmarked chips are packaged.
Chocolate-coated marshmallow treats, also known as chocolate teacakes, are confections consisting of a biscuit base topped with marshmallow-like filling and then coated in a hard shell of chocolate. They were invented in Denmark in the 19th century [ 1 ] under the name Flødeboller (cream buns), and later also produced and distributed by Viau ...
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
The candy bar consists of a cocoa-flavored marshmallow center which is covered with compound chocolate (a chocolate replacement made from cocoa, sugar, and vegetable fats) and sprinkled with coconut flakes. The oblong shape of the candy bar resembles a potato. [3] The product has 180 calories and weighs 1.5 ounces or 43 grams.
Pierce each candy bar with a pop stick, place on the prepared baking sheet, and refrigerate 30 minutes. Whisk all batter ingredients until little to no lumps remain. One at a time, dip chilled candy bars in batter and coat well. Once oil reaches 390°F, carefully place candy bars in oil one at a time and fry about 3 to 4 minutes.
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps.
Confectionery can be mass-produced in a factory. The oldest recorded use of the word confectionery discovered so far by the Oxford English Dictionary is by Richard Jonas in 1540, who spelled or misspelled it as "confection nere" in a passage "Ambre, muske, frankencense, gallia muscata and confection nere", thus in the sense of "things made or sold by a confectioner".
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