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The equipment and materials used in this stage are a stencil, solder paste, and a printer. The stencil printing function is achieved through a single material namely solder paste which consists of solder metal and flux. Paste also acts as an adhesive during component placement and solder reflow. The tackiness of the paste enables the components ...
The amount of time solder paste can stay on a stencil without affecting its printing properties. The paste manufacturer provides this value. Tack Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes.
Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer .
Screen-printing is the process of transferring an ink through a patterned woven mesh screen or stencil using a squeegee. [8] For improving accuracy, increasing integration density and improving line and space accuracy of traditional screen-printing photoimageable thick-film technology has been developed. Use of these materials however changes ...
The graping phenomenon can be resolved utilizing proper solder materials in addition to correct reflow profile settings. Solder powders are available that provide a tighter distribution range as well as a high oxidation barrier. This barrier not only improves the paste release from the stencil, but also provides an ideal surface area-to-volume ...
Squeegees with hard rubber or metal blades are used in stencil printing to apply solder paste to printed circuit boards (PCBs). [34] Small, hand-held plastic and rubber wedges with an edge formed as a blade are used in signwriting for the application of vinyl sheeting to decrease the possibility of air pockets.
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Without them the printer would not print the solder paste in exact alignment with the pads. Parts requiring a very high degree of placement precision, such as ball grid array packages, may have additional local fiducials near the package placement area of the board to further fine-tune the targeting.
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