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  2. Solder paste - Wikipedia

    en.wikipedia.org/wiki/Solder_paste

    A solder paste with long tack life is more likely to provide the user with a consistent and robust printing process. Response-to-pause A large variation in the print volume after a pause is unacceptable as this causes end of line defects such as shorts or opens.

  3. Stencil printing - Wikipedia

    en.wikipedia.org/wiki/Stencil_Printing

    Stencil printing is the process of depositing solder paste on the printed wiring boards (PWBs) to establish electrical connections. It is immediately followed by the component placement stage. The equipment and materials used in this stage are a stencil , solder paste, and a printer.

  4. Surface-mount technology - Wikipedia

    en.wikipedia.org/wiki/Surface-mount_technology

    Solder paste, a sticky mixture of flux and tiny solder particles, is first applied to all the solder pads with a stainless steel or nickel stencil using a screen printing process. It can also be applied by a jet-printing mechanism, similar to an inkjet printer .

  5. Thick-film technology - Wikipedia

    en.wikipedia.org/wiki/Thick-film_technology

    Screen-printing is the process of transferring an ink through a patterned woven mesh screen or stencil using a squeegee. [8] For improving accuracy, increasing integration density and improving line and space accuracy of traditional screen-printing photoimageable thick-film technology has been developed. Use of these materials however changes ...

  6. Soldering - Wikipedia

    en.wikipedia.org/wiki/Soldering

    Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

  7. Printed circuit board manufacturing - Wikipedia

    en.wikipedia.org/wiki/Printed_circuit_board...

    High volume production is usually done with a pick-and-place machine and bulk wave soldering for through-hole parts or reflow ovens for SMT components or through-hole parts, but skilled technicians are able to hand-solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.) [29] under a microscope, using tweezers and a ...

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  9. Reflow soldering - Wikipedia

    en.wikipedia.org/wiki/Reflow_soldering

    Reflow soldering is a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent ...

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