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2. Dip soldering - Wikipedia

   en.wikipedia.org/wiki/Dip_soldering

   Dip soldering apparatus. Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board (those not protected with solder mask), creating a mechanical and electrical connection.

3. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Wave soldering uses surface tension to keep solder from bridging the insulating gaps between the copper lines of flux-coated printed wiring boards/printed circuit boards. The electric soldering iron is widely used for hand-soldering, consisting of a heating element in contact with the "iron" (a larger mass of metal, usually copper) which is in ...

4. Point-to-point construction - Wikipedia

   en.wikipedia.org/wiki/Point-to-point_construction

   Even after the introduction of printed circuit boards, it did not require laying out and manufacturing circuit boards. Point-to-point and terminal strip construction continued to be used for some vacuum tube equipment even after the introduction of printed circuit boards. The heat of the tubes can degrade the circuit boards and cause them to ...

5. Printed circuit board manufacturing - Wikipedia

   en.wikipedia.org/wiki/Printed_circuit_board...

   Printed circuit board manufacturing is the process of manufacturing bare printed circuit boards (PCBs) and then populating them with electronic components. It involves the full assembly of a board into a functional circuit board. In board manufacturing, multiple PCBs are grouped on a single panel for efficient processing.

6. Potting (electronics) - Wikipedia

   en.wikipedia.org/wiki/Potting_(electronics)

   When potting a circuit board that uses surface-mount technology, low glass transition temperature (T g) potting compounds such as polyurethane or silicone may be used. High T g potting compounds may break solder bonds through solder fatigue by hardening at a higher temperature because the coating then shrinks as a rigid solid over a larger part ...

7. Component placement - Wikipedia

   en.wikipedia.org/wiki/Component_placement

   Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

8. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and ...

9. Reflow oven - Wikipedia

   en.wikipedia.org/wiki/Reflow_oven

   A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs). In commercial high-volume use, reflow ovens take the form of a long tunnel containing a conveyor belt along which PCBs travel. For prototyping or hobbyist use PCBs can be placed in a small oven with a door.