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2. Solder ball - Wikipedia

   en.wikipedia.org/wiki/Solder_ball

   The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux. [2] A coined solder ball is a solder ball subject to coining, i.e., flattening to a shape resembling that of a coin, to increase contact reliability. [3] Ball grid array, chip-scale package, and flip chip packages generally use solder balls.

3. Flip chip - Wikipedia

   en.wikipedia.org/wiki/Flip_chip

   To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down onto connectors or pads on the underlying electronics or circuit board or substrate. The solder is then re-melted to produce an electrical connection, typically using a thermosonic bonding or alternatively reflow solder process. [7]

4. Component placement - Wikipedia

   en.wikipedia.org/wiki/Component_placement

   Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards (PCBs) to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs (leads-pads). The component leads must be accurately immersed in the solder paste previously ...

5. List of electronic component packaging types - Wikipedia

   en.wikipedia.org/wiki/List_of_electronic...

   Low-profile fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm; Micro ball grid array : Ball spacing less than 1 mm; Thin fine-pitch ball grid array : A square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm

6. Ball grid array - Wikipedia

   en.wikipedia.org/wiki/Ball_grid_array

   A grid array of solder balls on a printed circuit board after removal of an integrated circuit chip. Cross-cut section of BGA mounted circuit. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits.

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8. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Tack is the property of a solder paste to hold a component after the component had been placed by the placement machine. Hence, tack life is the critical property of solder pastes. It is defined as the length of time that solder paste can remain exposed to the atmosphere without a significant change in tack properties.

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