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2. Solder paste - Wikipedia

   en.wikipedia.org/wiki/Solder_paste

   Although solder paste typically contains around 90% metal in solids by weight, the volume of the soldered joint is only about half that of the solder paste applied. [7] This is due to the presence of flux and other non-metallic agents in the paste, and the lower density of the metal particles when suspended in the paste as compared to the final ...

3. Flux (metallurgy) - Wikipedia

   en.wikipedia.org/wiki/Flux_(metallurgy)

   Rosin used as flux for soldering A flux pen used for electronics rework Multicore solder containing flux Wire freshly coated with solder, held above molten rosin flux. In metallurgy, a flux is a chemical reducing agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time.

4. Soldering - Wikipedia

   en.wikipedia.org/wiki/Soldering

   Reflow soldering is a process in which a solder paste (a mixture of prealloyed solder powder and a flux-vehicle that has a peanut butter-like consistency [8]) is used to stick the components to their attachment pads, after which the assembly is heated by an infrared lamp, a hot air pencil, or, more commonly, by passing it through a carefully ...

5. Stencil printing - Wikipedia

   en.wikipedia.org/wiki/Stencil_Printing

   Ideally, a solder paste should have, at minimum, a 4-hour stencil life. The stencil life is defined as a time period in which there will be no significant change in the solder paste material characteristics. A solder paste with a longer stencil life will be more robust in the printing process.

6. Rosin - Wikipedia

   en.wikipedia.org/wiki/Rosin

   Rosin is an ingredient in printing inks, photocopying and laser printing paper, varnishes, adhesives (glues), soap, paper sizing, soda, soldering fluxes, and sealing wax. Rosin can be used as a glazing agent in medicines and chewing gum. It is denoted by E number E915. A related glycerol ester (E445) can be used as an emulsifier in soft drinks.

7. Graping - Wikipedia

   en.wikipedia.org/wiki/Graping

   The increased surface oxidation is the result of smaller printed paste deposit volumes that cause a diminished surface area to flux ratio of the solder particle, resulting in flux exhaustion. While solder paste can be manufactured using any size range, there has been a move towards finer particle sizes, especially for fine feature stencil ...