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IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.
The most common [citation needed] standards for conformal coating are IPC A-610 [9] and IPC-CC-830. [10] These standards list indications of good and bad coverage and describe various failure mechanisms, such as dewetting. Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings ...
A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A very large number of package types exist.
IEEE 200-1975 or "Standard Reference Designations for Electrical and Electronics Parts and Equipments" is a standard that was used to define referencing naming systems for collections of electronic equipment. IEEE 200 was ratified in 1975. The IEEE renewed the standard in the 1990s, but withdrew it from active support shortly thereafter.
IPC-9708 provides three test methods to characterize the pad cratering of a component and PCBA: pin pull, ball pull, and ball shear testing. [5] In the pin pull test a pin is soldered to pads and pulled until fracture. It is a useful test for all pad geometries and is sensitive to board design and materials.
Available standard laminate thickness are listed in ANSI/IPC-D-275. [23] The cloth or fiber material used, resin material, and the cloth to resin ratio determine the laminate's type designation (FR-4, CEM-1, G-10, etc.) and therefore the characteristics of the laminate produced.
Four-PCB panel. Depaneling or depanelization is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often arranged in a process called panelization so that they consist of many smaller individual PCBs that will be used in the final product.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
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