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  2. Copper electroplating - Wikipedia

    en.wikipedia.org/wiki/Copper_electroplating

    Acid copper sulfate electrolytes are relatively simple solutions of copper sulfate and sulfuric acid that are cheaper and easier to maintain and control than cyanide copper electrolytes. [2] Compared to cyanide baths, they provide higher current efficiency and allow for higher current density and thus faster plating rates, but they usually have ...

  3. Electroplating - Wikipedia

    en.wikipedia.org/wiki/Electroplating

    The electrolyte in the electrolytic plating cell should contain positive ions (cations) of the metal to be deposited. These cations are reduced at the cathode to the metal in the zero valence state. For example, the electrolyte for copper electroplating can be a solution of copper(II) sulfate, which dissociates into Cu 2+ cations and SO 2− 4 ...

  4. Cold water pitting of copper tube - Wikipedia

    en.wikipedia.org/wiki/Cold_water_pitting_of...

    Copper water tubes are usually guaranteed by the manufacturer against manufacturing defects for a period of 50 years. The vast majority of copper systems far exceed this time period but a small minority may fail after a comparatively short time. The majority of failures seen are the result of poor installation or operation of the water system.

  5. Erosion corrosion of copper water tubes - Wikipedia

    en.wikipedia.org/wiki/Erosion_corrosion_of...

    Erosion corrosion, also known as impingement damage, is the combined effect of corrosion and erosion caused by rapid flowing turbulent water.It is probably the second most common cause of copper tube failures behind Type 1 pitting which is also known as Cold Water Pitting of Copper Tube.

  6. Electroless deposition - Wikipedia

    en.wikipedia.org/wiki/Electroless_deposition

    Elemental zinc is dipped into a copper (II) sulphate solution. Red deposit is the reduction process in which Cu (II) is converted to elemental Cu. Elemental Zn is oxidized to Zn (II) and dissolves into solution. The electroless deposition and electroplating bath actively performs cathodic and anodic reactions at the surface of the substrate.

  7. Copper tubing - Wikipedia

    en.wikipedia.org/wiki/Copper_tubing

    Type Z is a thinner walled pipe, also used for above-ground service, including drinking water supply, hot and cold water systems, sanitation, central heating and other general purpose applications. In the plumbing trade, the size of copper tubing is measured by its outside diameter in millimeters.

  8. Corrosion inhibitor - Wikipedia

    en.wikipedia.org/wiki/Corrosion_inhibitor

    In areas with widespread lead and copper piping systems, corrosion control using inhibitors and monitoring techniques is central to water safety. Figures such as the chloride-to-sulfate mass ratio (CSMR) can be used to estimate the risk of corrosion at galvanic connections (i.e. desimilar pipe/solder connections, such as a lead-to-iron transition).

  9. Hydrogen embrittlement - Wikipedia

    en.wikipedia.org/wiki/Hydrogen_embrittlement

    Electroplating is a commonly used method to deposit a protective layer onto the metal surface. This process involves immersing the metal substrate into an electrolyte solution containing metal ions. By applying an electric current, the metal ions are reduced and form a metallic coating on the substrate.

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