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  2. International Patent Classification - Wikipedia

    en.wikipedia.org/wiki/International_Patent...

    The International Patent Classification (IPC) is a hierarchical patent classification system used in over 100 countries to classify the content of patents in a uniform manner. It was created under the Strasbourg Agreement (1971), one of a number of treaties administered by the World Intellectual Property Organization (WIPO).

  3. Strasbourg Agreement Concerning the International Patent ...

    en.wikipedia.org/wiki/Strasbourg_Agreement...

    The Strasbourg Agreement Concerning the International Patent Classification (or IPC), also known as the IPC Agreement, is an international treaty that established a common classification for patents for invention, inventors' certificates, utility models and utility certificates, known as the "International Patent Classification" (IPC). [6]

  4. Cooperative Patent Classification - Wikipedia

    en.wikipedia.org/wiki/Cooperative_Patent...

    An example of the CPC classification scheme [4] in the area of agriculture is shown in the figure. The text in curly brackets {..} refers to text provided by the CPC classification scheme. The rest of the text refers to text originating from the International Patent Classification.

  5. Patent classification - Wikipedia

    en.wikipedia.org/wiki/Patent_classification

    In October 2010, the European Patent Office (EPO) and USPTO launched a joint project to create the Cooperative Patent Classification (CPC) to harmonise the patent classifications systems between the two offices. From 2013, CPC replaced the European Classification (ECLA), which was based on the IPC but adapted by the EPO.

  6. List of electronic component packaging types - Wikipedia

    en.wikipedia.org/wiki/List_of_electronic...

    According to IPC's standard J-STD-012, Implementation of Flip Chip and Chip Scale Technology, in order to qualify as chip scale, the package must have an area no greater than 1.2 times that of the die and it must be a single-die, direct surface mountable package.

  7. IPC (electronics) - Wikipedia

    en.wikipedia.org/wiki/IPC_(electronics)

    IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

  8. NYT ‘Connections’ Hints and Answers Today, Friday, December 13

    www.aol.com/nyt-connections-hints-answers-today...

    Today's NYT Connections puzzle for Friday, December 13, 2024The New York Times

  9. B3 (classification) - Wikipedia

    en.wikipedia.org/wiki/B3_(classification)

    Cycling classification assignment for this class may be handled by the UCI, as was the case at the 2008 Summer Paralympic. [11] Otherwise, the swimmer competes under the normal rules governing Fédération Internationale de Natation (FINA), the sport's highest authority, swimming competitions. [19] Swimming classification handled by IPC ...

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