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Electroless copper plating is a chemical process that deposits an even layer of copper on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing copper salts and a reducing agent such as formaldehyde .
Electroless deposition is advantageous in comparison to PVD, CVD, and electroplating deposition methods because it can be performed at ambient conditions. [2] [6] The plating method for Ni-P, Ni-Au, Ni-B, and Cu baths are distinct; however, the processes involve the same approach. The electroless deposition process is defined by four steps: [2 ...
Copper plating on aluminium. Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. [1]
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes.
PCB copper electroplating line in the process of pattern plating copper The two processing methods used to produce a double-sided PWB with plated-through holes. The process by which copper traces are applied to the surface is known as etching after the subtractive method of the process, though there are also additive and semi-additive methods.
Electroless deposition (ED) or electroless plating is defined as the autocatalytic process through which metals and metal alloys are deposited onto nonconductive surfaces. These nonconductive surfaces include plastics, ceramics, and glass etc., which can then become decorative, anti-corrosive, and conductive depending on their final functions.
The processed surface is then coated with electroless copper or nickel before further plating. This process gives useful (about 1 to 6 kgf /cm or 10 to 60 N /cm or 5 to 35 lbf /in) adhesion force, but is much weaker than actual metal-to-metal adhesion strength.
Copper plating may refer to: Copper electroplating , a technique of electroplating a layer of copper onto a metal object Electroless copper plating , an auto-catalytic chemical technique used to deposit a layer of copper on a solid workpiece
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