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2. Wire bonding - Wikipedia

   en.wikipedia.org/wiki/Wire_bonding

   Wire bonding is a method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Wire bonding can also be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another, although these are less common. Wire ...

3. Electrical bonding - Wikipedia

   en.wikipedia.org/wiki/Electrical_bonding

   Electrical bonding is the practice of intentionally electrically connecting all exposed metal items not designed to carry electricity in a room or building as protection from electric shock. Bonding is also used to minimize electrical arcing between metal surfaces with electrical potential differences.

4. Lead frame - Wikipedia

   en.wikipedia.org/wiki/Lead_frame

   The die is glued or soldered to the die pad inside the lead frame, and then bond wires are attached between the die and the bond pads to connect the die to the leads in a process called wire bonding. In a process called encapsulation, a plastic case is moulded around the lead frame and die, exposing only the leads.

5. Chip on board - Wikipedia

   en.wikipedia.org/wiki/Chip_on_board

   In "wire bonding", the chip is attached to the board with an adhesive. Each pad on the device is connected with a fine wire lead that is welded to the pad and to the circuit board. This is similar to the way that an integrated circuit is connected to its lead frame, but instead the chip is wire-bonded directly to the circuit board. [3]

6. Flip chip - Wikipedia

   en.wikipedia.org/wiki/Flip_chip

   The individual chips are patterned with small pads of metal near their edges that serve as the connections to an eventual mechanical carrier. The chips are then cut out of the wafer and attached to their carriers, typically via wire bonding such as thermosonic bonding. These wires eventually lead to pins on the outside of the carriers, which ...

7. Ball bonding - Wikipedia

   en.wikipedia.org/wiki/Ball_bonding

   Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication. Gold or copper wire can be

8. The 25 movies we're most looking forward to in 2025 - AOL

   www.aol.com/news/25-movies-were-most-looking...

   Meredith Blake, Greg Braxton, Matt Brennan, Tracy Brown, Amy Kaufman, Ashley Lee, Mary McNamara, Amy Nicholson, Mark Olsen, Joshua Rothkopf, Josh Rottenberg, Glenn Whipp

9. Wedge bonding - Wikipedia

   en.wikipedia.org/wiki/Wedge_bonding

   Wedge bonding is a kind of wire bonding which relies on the application of ultrasonic power and force to form bonds. It is a popular method and is commonly used in the semiconductor industry. Wedge bonding is directional, so the bonding head rotates to accommodate the different angles for bonding.