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Wafers grown using materials other than silicon will have different thicknesses than a silicon wafer of the same diameter. Wafer thickness is determined by the mechanical strength of the material used; the wafer must be thick enough to support its own weight without cracking during handling. The tabulated thicknesses relate to when that process ...
Once tested, a wafer is typically reduced in thickness in a process also known as "backlap", [118]: 6 "backfinish", "wafer backgrind" or "wafer thinning" [191] before the wafer is scored and then broken into individual dies, a process known as wafer dicing. Only the good, unmarked chips are packaged.
Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in a semiconductor device fabrication process. Examples include production of radio frequency amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer ...
When silicon is grown by the Czochralski method, the melt is contained in a silica crucible. During growth, the walls of the crucible dissolve into the melt and Czochralski silicon therefore contains oxygen at a typical concentration of 10 18 cm −3. Oxygen impurities can have beneficial or detrimental effects.
Wafering is the process by which a silicon crystal is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.
This year, in addition to classics like rugelach, spritz and thumbprint cookies, include benne seed wafers in your cookie spread. Benne seed cookies are a traditional Kwanzaa cookie made with ...
More Dessert Recipes to Try: While the oven's still on, want try your hand at more baking? Check out our 21 Decadent Pie Recipes, ... Easy, From-Scratch Baking Recipes. Lori Lange.
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC). ICs are produced on semiconductor wafers that undergo a multitude of processing steps.