Search results
Results from the WOW.Com Content Network
Diamond wire saw in stone industry. A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire [1] to dice, cut, or groove semiconductor wafers, and glass, ceramic, crystal, and many other types of material.
DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.. The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage ...
This is a list of semiconductor fabrication plants, factories where integrated circuits (ICs), also known as microchips, are manufactured.They are either operated by Integrated Device Manufacturers (IDMs) that design and manufacture ICs in-house and may also manufacture designs from design-only (fabless firms), or by pure play foundries that manufacture designs from fabless companies and do ...
The company’s semiconductor products include automated ultra-thin wafer dicing and high-throughput, high-accuracy grooving systems. [44] In the area of component test and inspection, ESI offers automated test, termination, high-speed handling and visual inspection equipment for manufacturing of miniature multilayer ceramic passive components ...
ASM (previously known as ASM International N.V., originally standing for Advanced Semiconductor Materials) is a Dutch headquartered multinational corporation that specializes in the design, manufacturing, sales and service of semiconductor wafer processing equipment for the fabrication of semiconductor devices.
Wuhan Xinxin Semiconductor Manufacturing, Co., Ltd. (XMC; Chinese: 新芯股份; pinyin: Xīnxīn Gǔfèn) is a Chinese semiconductor integrated device manufacturer. It produces logic chips, contact image sensors and NOR flash memory. It is a subsidiary of Yangtze Memory Technologies (YTMC) and plays an integral part in its 3D NAND memory ...
Apollo Diamond Inc. was a company based in Boston, Massachusetts that was able to produce nearly flawless single crystal diamond wafers and crystals for potential use in the optoelectronics, nanotechnology, and consumer gem markets.
The RCA clean is a standard set of wafer cleaning steps which need to be performed before high-temperature processing steps (oxidation, diffusion, CVD) of silicon wafers in semiconductor manufacturing. Werner Kern developed the basic procedure in 1965 while working for RCA, the Radio Corporation of America.