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  2. Monocrystalline silicon - Wikipedia

    en.wikipedia.org/wiki/Monocrystalline_silicon

    The primary application of monocrystalline silicon is in the production of discrete components and integrated circuits.Ingots made by the Czochralski method are sliced into wafers about 0.75 mm thick and polished to obtain a regular, flat substrate, onto which microelectronic devices are built through various microfabrication processes, such as doping or ion implantation, etching, deposition ...

  3. Boule (crystal) - Wikipedia

    en.wikipedia.org/wiki/Boule_(crystal)

    Monocrystalline silicon boule. A boule is a single-crystal ingot produced by synthetic means. [1]A boule of silicon is the starting material for most of the integrated circuits used today.

  4. Czochralski method - Wikipedia

    en.wikipedia.org/wiki/Czochralski_method

    Monocrystalline silicon (mono-Si) grown by the Czochralski method is often referred to as monocrystalline Czochralski silicon (Cz-Si). It is the basic material in the production of integrated circuits used in computers, TVs, mobile phones and all types of electronic equipment and semiconductor devices. [6]

  5. Crystalline silicon - Wikipedia

    en.wikipedia.org/wiki/Crystalline_silicon

    Crystalline silicon or (c-Si) is the crystalline forms of silicon, either polycrystalline silicon (poly-Si, consisting of small crystals), or monocrystalline silicon (mono-Si, a continuous crystal). Crystalline silicon is the dominant semiconducting material used in photovoltaic technology for the production of solar cells .

  6. Single crystal - Wikipedia

    en.wikipedia.org/wiki/Single_crystal

    Monocrystalline silicon used in the fabrication of semiconductors and photovoltaics is the greatest use of single-crystal technology today. [14] In photovoltaics, the most efficient crystal structure will yield the highest light-to-electricity conversion. [ 15 ]

  7. Planar process - Wikipedia

    en.wikipedia.org/wiki/Planar_process

    Together with the use of metallization, and the concepts of p–n junction isolation and surface passivation, it is possible to create circuits on a single silicon crystal slice (a wafer) from a monocrystalline silicon boule. The process involves the basic procedures of silicon dioxide (SiO 2) oxidation, SiO 2 etching and heat

  8. Semiconductor device fabrication - Wikipedia

    en.wikipedia.org/wiki/Semiconductor_device...

    FEOL processing refers to the formation of the transistors directly in the silicon. The raw wafer is engineered by the growth of an ultrapure, virtually defect-free silicon layer through epitaxy . [ 160 ] [ 161 ] In the most advanced logic devices , prior to the silicon epitaxy step, tricks are performed to improve the performance of the ...

  9. Epitaxy - Wikipedia

    en.wikipedia.org/wiki/Epitaxy

    Centrifugal liquid-phase epitaxy is used commercially to make thin layers of silicon, germanium, and gallium arsenide. [17] [18] Centrifugally formed film growth is a process used to form thin layers of materials by using a centrifuge. The process has been used to create silicon for thin-film solar cells [19] [20] and far-infrared ...