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  2. Physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Physical_vapor_deposition

    Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polymers. PVD is characterized by a process in which the material transitions from a condensed phase to a ...

  3. Sputter deposition - Wikipedia

    en.wikipedia.org/wiki/Sputter_deposition

    Sputter coating in scanning electron microscopy is a sputter deposition process [clarification needed] to cover a specimen with a thin layer of conducting material, typically a metal, such as a gold/palladium (Au/Pd) alloy. A conductive coating is needed to prevent charging of a specimen with an electron beam in conventional SEM mode (high ...

  4. Titanium nitride - Wikipedia

    en.wikipedia.org/wiki/Titanium_nitride

    Titanium nitride (TiN; sometimes known as tinite) is an extremely hard ceramic material, often used as a physical vapor deposition (PVD) coating on titanium alloys, steel, carbide, and aluminium components to improve the substrate's surface properties.

  5. Ion plating - Wikipedia

    en.wikipedia.org/wiki/Ion_plating

    Ion plating (IP) is a physical vapor deposition (PVD) process that is sometimes called ion assisted deposition (IAD) or ion vapor deposition (IVD) and is a modified version of vacuum deposition. Ion plating uses concurrent or periodic bombardment of the substrate, and deposits film by atomic-sized energetic particles called ions.

  6. Electron-beam physical vapor deposition - Wikipedia

    en.wikipedia.org/wiki/Electron-beam_physical...

    The PVD process can be carried out at lower deposition temperatures and without corrosive products, but deposition rates are typically lower. Electron-beam physical vapor deposition, however, yields a high deposition rate from 0.1 to 100 μm / min at relatively low substrate temperatures, with very high material utilization efficiency.

  7. Vacuum deposition - Wikipedia

    en.wikipedia.org/wiki/Vacuum_deposition

    When the vapor source is a liquid or solid, the process is called physical vapor deposition (PVD), [3] which is used in semiconductor devices, thin-film solar panels, and glass coatings. [4] When the source is a chemical vapor precursor, the process is called chemical vapor deposition (CVD).

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  9. Titanium aluminium nitride - Wikipedia

    en.wikipedia.org/wiki/Titanium_aluminium_nitride

    The coatings are mostly deposited by cathodic arc deposition or magnetron sputtering. Even though most TiAlN and AlTiN coatings are industrially synthesized using alloy targets with specific percentages of aluminium and titanium it is possible to produce TiAlN coatings with pure Al and Ti targets using a cathodic arc deposition technique.